1. About the application field of FOG/FOB bonding equipment XCM71 - A5
FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as. television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises.
2.About the basic parameters of FOG/FOB bonding equipment XCM71 -A5
Input Power. AC220V 50-60Hz
Working pressure .0.4-0 .8 Mpa
Operating modes. 7-inch HMI
Dimensions. L2210 × W1730 × H1500 mm
The method of Heating. heating or pulse heating thermostat
The quantity of Fixture. 2 group X-Y-θ micrometer adjustable
Range of Temperature . RT-500
Control program. PLC controller
Body main material. Steel + baking varnish
The thermocouple. K type
3.About the functions and characteristics of the FOG/FOB bonding equipment XCM71 - A5
3.1use pneumatic components of Japan SMC and high-precision the moving parts
3.2 use temperature controller of Japan and The function module of the integral PID self-tuning temperature,accurate temperature.
3.3 Imported PLC control.the operation of 7-inch full-color touch-screen
3.4SUNSOM the elimination structure of double-cylinder deadweight, accurate pressure.
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